achievements
Compound beam scanning module
Summary
Creatively use of three-dimensional programmable compound beam scanning technology with high environmental stability, the ultra-high precision scanning of light beam and that can realize high quality machining of small-scale special-shaped microstructure. As the physical carrier of the compound beam scanning technology, it can solve the problems of deep micro hole, deep groove, cutting materials with big thickness, as well as the processing of complex side profile structure such as inclined hole and dustpan, which promotes the design and manufacture of aero-engine.
Product photo show
Compound beam scanning module
Characteristics of product
- High environmental stability；
- Taper controllable；
- Realize deep micro hole and special hole structure processing；
Performance indicators
Main technical index
The sample application
Special hole
Relevant articles and patents：
Yang Xiaojun, Zhang Xiao, Cheng Guanghua, a method of adjusting the dynamic transverse displacement of laser beam, 2006.06.15, ZL201110160682.9, China;
Li Peng, Yang Xiaojun, Li Ming, Zhao Hualong, Zhao Wei, a laser micro hole processing beam scanning device with controllable taper and its control method, April 24, 2013, ZL201210573983.9, China;
Kang Wei, Wang Ning, Zhao Hualong, Yang Xiaojun, a device for adjusting the position of optical elements, 2015.09.09, ZL201510569603.8 ,China;
Kang Wei, Zhao Hualong, five bar mechanism, swing mirror system and two-dimensional swing mirror device, October 13, 2015, zl201520802671.X, China.
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